Technical Details

• Features Low Profile
• Package / Case Nonstandard Chip
• Size / Dimension 0.010" L x 0.010" W (0.25mm x 0.25mm)
• Operating Temperature -55°C ~ 150°C
• Height 0.005" (0.12mm)
• Applications High Stability, Vertical Silicon Cap, Wirebond
• Capacitance 270 pF
• Voltage - Breakdown 50 V